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October_Silicon Photonics|Global Silicon Photonics Technology Development Overview(Up)

Currently, silicon photonics technology is usually fabricated on SOI wafers containing a laser source that converts electrical signals into optical signals, a light sensor that converts optical signals into electrical signals, and an optical sensor that converts optical signals into electrical signals. ... Read more

2023-09-25t14:29:34+08:002023/09/25|Categories: 科技(Technology)|Tags: , , |

October_Silicon Photonics|Global Silicon Photonics Market Overview(Up)

With the rapid development of new technologies such as AI, Internet of Things, 5G, etc. driving the demand for huge amounts of data computing, in addition to the use of high-speed computing chips, inter-chip communication is another way to improve operation. ... Read more

2023-09-25t14:28:29+08:002023/09/25|Categories: 科技(Technology)|Tags: , , |

September_SiC Silicon Carbide Special Topics|SiC Wafer Fabrication Process Technology Development Overview(Next)

The grown silicon carbide monocrystalline anchors are then subjected to a cutting process. Due to its hardness and brittle characteristics, it is difficult to cut the ingots and is prone to wear and tear. ... Read more

2023-09-07t16:27:32+08:002023/09/07|Categories: 科技(Technology)|Tags: , , |

September_SiC Silicon Carbide Special Topics|SiC Wafer Fabrication Process Technology Development Overview(Up)

The production of silicon carbide substrate needs to go through the process steps such as long crystal, cutting, edge guiding, grinding, polishing, cleaning, shipment inspection, etc., among which the key to affect the quality is long crystal, cutting, and so on. ... Read more

2023-09-07t16:21:40+08:002023/09/01|Categories: 科技(Technology)|Tags: , , |

September_SiC Silicon Carbide Special|SiC Silicon Carbide Substrate Market Development Current Analysis

The global electric vehicle and renewable energy markets are booming, driven by energy-saving and carbon-reduction policies and subsidy programs in various countries, which is driving huge demand for power components, but commonly used components are also in high demand. ... Read more

2023-09-07t10:36:34+08:002023/09/01|Categories: 科技(Technology)|Tags: , , |

August_Semiconductor|Advanced Packaging Technology for High Performance Computing Chips(M)

According to the Blueprint for Heterogeneous Integration Technology released by IEEE, short-term high-performance computing chips are based on large-area intermediary layers, embedded bridge carrier boards, and small-aperture-ratio silicon chips. ... Read more

2023-08-23t17:57:38+08:002023/08/14|Categories: 科技(Technology)|

August_Semiconductor|Advanced Packaging Technology for High Performance Computing Chips(Up)

As transistor size shrinkage approaches physical limits, advanced manufacturing processes are becoming more difficult, resulting in higher wafer production costs. For a wafer with a monthly wafer throughput of 50,000 wafers, the cost of wafer production is increasing. ... Read more

2023-08-23t17:15:14+08:002023/08/14|Categories: 科技(Technology)|
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