Equipment and materials are the key pillars driving the development of the market and the industry. According to market research organization Yole Développement, it is estimated that by 2024, the entire market will have a total of 1.5 million tons of equipment and materials. ... Read more
According to a report published by Yole Développement, the global fan-out packaging market size is 1.86 billion by 2022. ... Read more
As advanced processes in the front-end of semiconductors are approaching their physical limits, relying on smaller component sizes to improve their operational capabilities is bound to face rising production costs. ... Read more
Wi-Fi 7, (IEEE 802.11be) is the latest generation of wireless networking technology, with a draft standard available in 2021, and a full version and associated ... Read more
Apple held a press conference on September 10th at 1:00 am Taiwan time, where it unsurprisingly announced the new generation of iPhone 16 series phones, Ap ... Read more
Linear Driven Pluggable Optics (LPO) LPO technology seems to be a mature but transitional product that can reduce power consumption without replacing the pluggable architecture. ... Read more
Co-packaged Optics (CPO) Co-packaged optics was developed for the application of silicon photonics chips in optical signaling modules. It is a technology that packages silicon photonics and switching chips into a single package. ... Read more
Continuing with the previous two articles on the market analysis of optical communication modules, we will now discuss the current trends and status of the important technology development of optical communication. Driven by the rise of generative AI ... Read more
At present, the status of silicon photonics implantation in the market is not yet clear, and there are many tug-of-war in the market, such as the specification? What is the mainstream technology? Whether it is compressed to the original light engine component manufacturers ... Read more
Last October, we published a series of silicon photonics and co-packaging reports, as the demand for hardware computing power for AI continues to rise, and the demand for data transmission continues to grow. ... Read more
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