Author：Lin Wei Zhi, Executive Vice President of Ji-Pu Industry Trend Research Institute CES (Consumer Electronics Show) is a trade show organized by the United States of America. ... Read more
2025 Technology/Semiconductor Executive Summary As the year 2024 comes to an end and we are about to welcome the arrival of 2025, Chipo observes that the global economy next year should be in the ... Read more
Market Conditions Before and After Trump's Election Trump's election as the new U.S. President and his expected return to power in January 2025, with his experience and absolute majority in Congress, will surely have a negative impact on Taiwan. ... Read more
Key News: U.S. chip maker Intel announced that former CEO Pat Gelsinger, who was appointed to the board on December 1, has been removed from the company's board of directors. ... Read more
The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and with the current AI and Large Language Modeling LLM (large lang ... Read more
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, which uses an intermediary layer as a bridge to connect each wafer and provide a high-speed communication interface. ... Read more
Why is 2.5D/3D packaging the mainstay of wafer fab production and why is it important? After the world's first integrated circuits were created in 1958, the performance of wafers was ... Read more
Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war began with trade friction and gradually turned to national ... Read more
Equipment and materials are the key pillars driving the development of the market and the industry. According to market research organization Yole Développement, it is estimated that by 2024, the entire market will have a total of 1.5 million tons of equipment and materials. ... Read more
According to a report published by Yole Développement, the global fan-out packaging market size is 1.86 billion by 2022. ... Read more
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