October_Silicon Photonics｜Global Silicon Photonics Market Overview(Next)
According to the report published by market research firm Yole Développement 2022, the global silicon photonics market size is estimated to grow from 20% to 20%. ... Read more
October_Silicon Photonics｜Global Silicon Photonics Market Overview(Up)
With the rapid development of new technologies such as AI, Internet of Things, 5G, etc. driving the demand for huge amounts of data computing, in addition to the use of high-speed computing chips, inter-chip communication is another way to improve operation. ... Read more
September_SiC Silicon Carbide Special Topics｜SiC Wafer Fabrication Process Technology Development Overview(Next)
The grown silicon carbide monocrystalline anchors are then subjected to a cutting process. Due to its hardness and brittle characteristics, it is difficult to cut the ingots and is prone to wear and tear. ... Read more
September_SiC Silicon Carbide Special Topics｜SiC Wafer Fabrication Process Technology Development Overview(Up)
The production of silicon carbide substrate needs to go through the process steps such as long crystal, cutting, edge guiding, grinding, polishing, cleaning, shipment inspection, etc., among which the key to affect the quality is long crystal, cutting, and so on. ... Read more
September_SiC Silicon Carbide Special｜SiC Silicon Carbide Substrate Market Development Current Analysis
The global electric vehicle and renewable energy markets are booming, driven by energy-saving and carbon-reduction policies and subsidy programs in various countries, which is driving huge demand for power components, but commonly used components are also in high demand. ... Read more
August_Semiconductor｜Advanced Packaging Technology for High Performance Computing Chips(Next)
Under this trend, in August 2020, TSMC announced at the Technology Forum the launch of a SoIC with 3D packaging and InFO and CoWoS with 2.5D packaging. ... Read more
August_Semiconductor｜Advanced Packaging Technology for High Performance Computing Chips(M)
According to the Blueprint for Heterogeneous Integration Technology released by IEEE, short-term high-performance computing chips are based on large-area intermediary layers, embedded bridge carrier boards, and small-aperture-ratio silicon chips. ... Read more
August_Semiconductor｜Advanced Packaging Technology for High Performance Computing Chips(Up)
As transistor size shrinkage approaches physical limits, advanced manufacturing processes are becoming more difficult, resulting in higher wafer production costs. For a wafer with a monthly wafer throughput of 50,000 wafers, the cost of wafer production is increasing. ... Read more
July_GAI Topic｜GAI trend reshapes the server industry chain
AI applications are blossoming, and many people are afraid that they will be replaced by AI. AI authority Ben Goertzel said that artificial intelligence may be replaced by AI in the future. ... Read more
July_GAI Topic｜Analyzing the market competition among Intel, AMD and NVIDIA from the perspective of computing architecture development (Next)
Recently, because of the ChatGPT, AI and its hardware layout have become the focus of the market, analyzing Intel, AMD and NVI from the products launched. ... Read more
