In addition to silicon photonics process technology, interface technology is also an important part of the process. Fig. 2 shows the development trend of communication interface for data centers, the earliest of which was the use of copper cables. ... Read more
Currently, silicon photonics technology is usually fabricated on SOI wafers containing a laser source that converts electrical signals into optical signals, a light sensor that converts optical signals into electrical signals, and an optical sensor that converts optical signals into electrical signals. ... Read more
According to the report published by market research firm Yole Développement 2022, the global silicon photonics market size is estimated to grow from 20% to 20%. ... Read more
With the rapid development of new technologies such as AI, Internet of Things, 5G, etc. driving the demand for huge amounts of data computing, in addition to the use of high-speed computing chips, inter-chip communication is another way to improve operation. ... Read more
The grown silicon carbide monocrystalline anchors are then subjected to a cutting process. Due to its hardness and brittle characteristics, it is difficult to cut the ingots and is prone to wear and tear. ... Read more
The production of silicon carbide substrate needs to go through the process steps such as long crystal, cutting, edge guiding, grinding, polishing, cleaning, shipment inspection, etc., among which the key to affect the quality is long crystal, cutting, and so on. ... Read more
The global electric vehicle and renewable energy markets are booming, driven by energy-saving and carbon-reduction policies and subsidy programs in various countries, which is driving huge demand for power components, but commonly used components are also in high demand. ... Read more
Under this trend, in August 2020, TSMC announced at the Technology Forum the launch of a SoIC with 3D packaging and InFO and CoWoS with 2.5D packaging. ... Read more
According to the Blueprint for Heterogeneous Integration Technology released by IEEE, short-term high-performance computing chips are based on large-area intermediary layers, embedded bridge carrier boards, and small-aperture-ratio silicon chips. ... Read more
As transistor size shrinkage approaches physical limits, advanced manufacturing processes are becoming more difficult, resulting in higher wafer production costs. For a wafer with a monthly wafer throughput of 50,000 wafers, the cost of wafer production is increasing. ... Read more
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