Currently, most of the optical signal input and output in co-packaged optics use edge couplers. The use of V-slot can simultaneously reduce the alignment error and transmission loss requirements, so that the signal loss from the fiber to the silicon photonics chip can be controlled within -1%. ...read more

To date, traditional pluggable optical modules have been developed in GBIC, SFP, XFP, QSFP, CFP, OSFP, etc. GBIC is an intermateable product that meets the international standards and can be ...read more

Although silicon photonics technology has been developed for more than 20 years, it is only in the past two years that the huge data transmission demand driven by the rise of generative AI has been explored and emphasized, and therefore its technology and the derived co-packaging optics, the market, and the development of silicon photonics technology have become more and more important. ...read more

In the past, since silicon photonics was mainly in the stage of technology research and development, without extensive commercial application, except for a few academic units, almost no domestic manufacturers invested in research and development, resulting in China's silicon photonics technology lagging far behind the United States and Europe. ...read more

In addition to silicon photonics process technology, interface technology is also an important part of the process. Figure 2 shows the development trend of communication interfaces for data centers. The earliest development was the use of copper cable connectors to connect telecommunication signals via the ...read more

Currently, silicon photonics technology is usually fabricated on SOI wafers containing a laser source that converts electrical signals into optical signals, a light sensor that converts optical signals into electrical signals, a modulator that increases the bandwidth of the optical signals, and a transmitter that increases the bandwidth of the optical signals. ...read more