Catalog
娛樂產業專題｜解析全球主題樂園佈局，瞄準全球實體娛樂產業新趨勢
Author: Mr. Lin Weizhi, Executive Vice President, Ji-Pu Industrial Trend Research Institute
Analyzing the global theme park landscape and targeting global entities ...read more
CES 2025專題｜在AI科技的世界中暢游
Author: Mr. Lin Weizhi, Executive Vice President, Ji-Pu Industrial Trend Research Institute
CES (Consumer Electronics) ...read more
2025趨勢預測｜科技半導體 重點趨勢預測
- 2025Technology/Semiconductor Executive Summary
特別專題｜川普2.0之台積電可能面對的影響
Market Conditions Before and After Trump's Election
Trump was elected as the new U.S. President and is expected to return to power in January 2025 with experience and an absolute majority. ...read more
產業評析｜季辛格下台，Intel未來走向？
Main news content:
U.S. chip maker Intel has announced that former CEO Pat Gelsing has been appointed to the board of directors of the company. ...read more
先進封裝設備材料專題｜先進封裝CoWos台灣供應鏈發展概況
The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and now AI and LLM (large language model) have become the most popular. ...read more
先進封裝設備材料專題｜2.5D/3D 封裝之重要性與關鍵的製程點(下)
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, using the intermediary layer as a bridge to connect each wafer and provide high-speed communication interfaces. ...read more
先進封裝設備材料專題｜2.5D/3D 封裝之重要性與關鍵的製程點(上)
2.5D/3DWhy is packaging the mainstay of wafer fab production and why is it important?
19 ...read more
先進封裝設備材料專題｜美中科技戰所牽動之半導體產業脈動
Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war started with trade friction and gradually shifted to national security and technological leadership. ...read more
