Catalog
March_Optical Communication｜Plug-in Optical Communication Module Market and Technology Development Overview(Top)
Author: Mr. Lin Weizhi, Executive Vice President, Ji-Pu Industrial Trend Research Institute
With the launch of OpenAI's O-Series models, DEEPSEEK's ...read more
February_Entertainment Industry｜Analyzing the global theme park layout, aiming at the new trend of global physical entertainment industry
Author: Mr. Lin Weizhi, Executive Vice President, Ji-Pu Industrial Trend Research Institute
Analyzing the global theme park landscape and targeting global entities ...read more
January_CES 2025 Feature｜Swimming in the World of AI Technology
Author: Mr. Lin Weizhi, Executive Vice President, Ji-Pu Industrial Trend Research Institute
CES (Consumer Electronics) ...read more
December_2025 Trend Forecast｜Technology Semiconductor Key Trend Forecasts
- 2025Technology/Semiconductor Executive Summary
December_Special Topics｜Trump 2.0: Possible Impacts on TSMC
Market Conditions Before and After Trump's Election
Trump was elected as the new U.S. President and is expected to return to power in January 2025 with experience and an absolute majority. ...read more
December_Industry Review｜Jishengger stepping down, where does Intel go from here?
Main news content:
U.S. chip maker Intel has announced that former CEO Pat Gelsing has been appointed to the board of directors of the company. ...read more
November_Advanced Packaging Materials｜Advanced Packaging CoWos Taiwan Supply Chain Overview
The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and now AI and LLM (large language model) have become the most popular. ...read more
October_Advanced Packaging Equipment Material｜Importance of 2.5D/3D Packaging and Critical Process Points(Next)
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, using the intermediary layer as a bridge to connect each wafer and provide high-speed communication interfaces. ...read more
October_Advanced Packaging Equipment Material｜Importance of 2.5D/3D Packaging and Critical Process Points(Up)
2.5D/3DWhy is packaging the mainstay of wafer fab production and why is it important?
19 ...read more
