Under this trend, in August 2020, TSMC announced at the Technology Forum the launch of a 3D Fabric platform integrating SoIC in 3D package with InFO and CoWoS in 2.5D package. ...read more

According to the Heterogeneous Integration Technology Blueprint report released by IEEE, short-term HPC chips are stacked with large intermediary layers, embedded bridge carrier boards, small aperture silicon through holes, and face-to-face chips, ...read more

With the shrinking transistor size approaching the physical limit, the cost of wafer production is rising due to the increasing difficulty of advanced manufacturing processes. For a fab with 50,000 wafers per month, it is estimated that the cost of wafer production has increased since 14nm. ...read more

AI applications are blooming, many people are afraid that they will be replaced by AI, AI authority Ben Goertzel (Ben Goertzel) said: artificial intelligence may replace 80% people in the next few years. ...read more

Recently, because of the ChatGPT fever, AI and its hardware layout have become the focus of the market, analyzing the advantages of the three major chip companies, Intel, AMD and NVIDIA, from the products launched. ...read more

After briefly reviewing the revenue performance of the three major chipset vendors in their main product lines, we will now analyze and discuss their technological competitiveness in CPUs, GPUs, and even computing products with other computing architectures. To summarize the three ...read more

Discussions about the competition between Intel and AMD are not new, and NVIDIA has always been a unique player in the graphics processing unit (GPU) space. ...read more

If we look at the major IC design, foundry, and even end-system companies from a broader perspective, it is clear that their revenue growth in 2022 will be different. Excluding the 2021 ...read more