Catalog
October_Silicon Photonics｜Global Silicon Photonics Market Overview(Up)
With the rapid development of new technologies such as AI, IoT, and 5G driving the demand for huge amounts of data computation, in addition to the use of high-speed computing chips, inter-chip communication is another key factor to increase the speed of computation. However ...read more
September_SiC Silicon Carbide Special Topics｜SiC Wafer Fabrication Process Technology Development Overview(Next)
The grown silicon carbide monocrystalline ingots are then subjected to a cutting process. Due to its hardness and brittle characteristics, the cutting of the ingots is difficult and prone to wear and tear, thus requiring high equipment stability. ...read more
September_SiC Silicon Carbide Special Topics｜SiC Wafer Fabrication Process Technology Development Overview(Up)
The production of silicon carbide substrate needs to go through the process steps such as long crystal, cutting, edge grinding, grinding, polishing, cleaning, shipment inspection, etc. Among them, the key to affect the quality is the long crystal and cutting process. The earliest production of silicon substrate was in 1892. ...read more
September_SiC Silicon Carbide Special｜SiC Silicon Carbide Substrate Market Development Current Analysis
The global electric vehicle and renewable energy markets are booming as a result of energy-saving and carbon reduction policies and subsidy programs in various countries, driving huge demand for power components, but commonly used silicon-based power components are struggling to keep up with the demand. ...read more
August_Semiconductor｜Advanced Packaging Technology for High Performance Computing Chips(Next)
Under this trend, in August 2020, TSMC announced at the Technology Forum the launch of a 3D Fabric platform integrating SoIC in 3D package with InFO and CoWoS in 2.5D package. ...read more
August_Semiconductor｜Advanced Packaging Technology for High Performance Computing Chips(M)
According to the Heterogeneous Integration Technology Blueprint report released by IEEE, short-term HPC chips are stacked with large intermediary layers, embedded bridge carrier boards, small aperture silicon through holes, and face-to-face chips, ...read more
August_Semiconductor｜Advanced Packaging Technology for High Performance Computing Chips(Up)
With the shrinking transistor size approaching the physical limit, the cost of wafer production is rising due to the increasing difficulty of advanced manufacturing processes. For a fab with 50,000 wafers per month, it is estimated that the cost of wafer production has increased since 14nm. ...read more
July_GAI Topic｜GAI trend reshapes the server industry chain
AI applications are blooming, many people are afraid that they will be replaced by AI, AI authority Ben Goertzel (Ben Goertzel) said: artificial intelligence may replace 80% people in the next few years. ...read more
July_GAI Topic｜Analyzing the market competition among Intel, AMD and NVIDIA from the perspective of computing architecture development (Next)
Recently, because of the ChatGPT fever, AI and its hardware layout have become the focus of the market, analyzing the advantages of the three major chip companies, Intel, AMD and NVIDIA, from the products launched. ...read more
