2025 Technology/Semiconductor Executive Summary As the year 2024 comes to an end and we are about to welcome the arrival of 2025, Chipo observes that the global economy next year should be in the ... Read more

Market Conditions Before and After Trump's Election Trump's election as the new U.S. President and his expected return to power in January 2025, with his experience and absolute majority in Congress, will surely have a negative impact on Taiwan. ... Read more

Key News: U.S. chip maker Intel announced that former CEO Pat Gelsinger, who was appointed to the board on December 1, has been removed from the company's board of directors. ... Read more

The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, which uses an intermediary layer as a bridge to connect each wafer and provide a high-speed communication interface. ... Read more

Why is 2.5D/3D packaging the mainstay of wafer fab production and why is it important? After the world's first integrated circuits were created in 1958, the performance of wafers was ... Read more

Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war began with trade friction and gradually turned to national ... Read more

Equipment and materials are the key pillars driving the development of the market and the industry. According to market research organization Yole Développement, it is estimated that by 2024, the entire market will have a total of 1.5 million tons of equipment and materials. ... Read more

According to a report published by Yole Développement, the global fan-out packaging market size is 1.86 billion by 2022. ... Read more

As advanced processes in the front-end of semiconductors are approaching their physical limits, relying on smaller component sizes to improve their operational capabilities is bound to face rising production costs. ... Read more

Wi-Fi 7, (IEEE 802.11be) is the latest generation of wireless networking technology, with a draft standard available in 2021, and a full version and associated ... Read more