Under this trend, in August 2020, TSMC announced at a technology forum the launch of a 3D fabric platform integrating SoIC in 3D packaging and InFO and CoWoS in 2.5D packaging, as shown in Fig. 5, of which the SoIC in the front section is a newer technology divided into wafer-to-wafer (CoW) and wafer-to-wafer (WoW) stacking and other two technologies. The back-end InFO and CoWoS were mass-produced in 2017 and 2012, respectively. According to the adoption of LSI (Local Silicon Interconnect) or not, InFO is divided into two categories, InOF-R and InOF-L. According to the type of intermediate layer material, CoWoS is divided into three categories, CoWoS-S, CoWoS-R, and CoWoS-L. -S / -R uses silicon intermediary layer, rewiring layer, and -L is a localized area, which is used to connect wafers by silicon intermediary layer. The -L is a localized area where the silicon intermediate layer is used to connect wafers, and the other areas are used for rewiring layers or carriers.