Catalog
October_Advanced Packaging Materials｜Semiconductor Industry Driven by US-China Technology War
Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war started with trade friction and gradually shifted to national security and technological leadership. ...read more
September_Panel Level Packaging Special｜Global Overview of Fan-out Panel Level Packaging Supply Chain Development
Equipment and materials are the key pillars driving the development of the market and the industry, according to market research organization Yole Développement estimates that the global fan-out packaging equipment and materials in 2024 will be the largest in the world. ...read more
September_Panel Level Packaging｜Fan Out Panel Level Packaging (FOPLP) Market and Technology Development Overview
According to a report published by Yole Développement, a market research firm, the global fan-out packaging market will reach USD 1.86 billion in 2022 and is estimated to reach USD 1.86 billion by 2026. ...read more
September_Panel Level Packaging｜Global Fan-Out Panel Level Packaging (FOPLP) Development Status
As advanced processes in the front-end of the semiconductor industry are approaching their physical limits, relying on smaller component sizes to improve their operational capabilities is bound to face rising production costs, so the global semiconductor industry has turned to advanced packaging as a way to improve their performance. ...read more
September_Wi-Fi 7｜Global Wi-Fi 7 Market and Technology Development Analysis
Wi-Fi 7 (IEEE 802.11be) is the latest generation of wireless networking technology, with a draft standard available in 2021, and a full version and associated certifications available in 2024. ...read more
September_Industry Analysis｜Apple New Products Business Trend Analysis
Apple held a press conference on September 10th at 1:00 AM Taiwan time, in which it unsurprisingly announced a new ...read more
August_Optical Communication Technology｜An Analysis of Advanced Optical Communication Module Technology Development (Next)
- Linear Drive Pluggable Optics (LPO)
The LPO technology seems to be a mature but transitional product that can be used without replacing the LPO technology. ...read more
August_Optical Communication｜Advanced Optical Communication Module Technology Development(M)
- Co-packaged Optics (CPO)
Co-packaged optical technology has been developed for the application of silicon photonic chips in optical signaling modules. ...read more
August_Optical Communication｜Advanced Optical Communication Module Technology Development(Up)
Continuing the market analysis of optical communication modules in the previous two articles, we will now discuss the current trends and status of the important technology development of optical communication. Due to the rise of generative AI, data center investment has become a major trend. ...read more
