Catalog
April_ChatGPT Discussion｜Global AI Development Process and Trends
As ChatGPT exploded in popularity, the term Artificial Intelligence has returned to the center of market discussion. Artificial Intelligence (AI) is a term used to refer to the process by which a computer is operated. ...read more
April_ChatGPT｜Integrating ChatGPT, the business opportunity created by the company is explored.
At the beginning of 2023, the hottest topic will be AI, especially chatbots. ...read more
March_Automotive MCU｜Automotive MCU Market and Technology Development(Up)
vehicularMCUMarket size and automotive specifications are discussed ...read more
March_Automotive MCU｜Worldwide MCU Market Trend Analysis (Next)
MCUTrends in the development of
According to market research firm IC In ...read more
March_Automotive MCU｜Worldwide MCU Market Trend Analysis (Up)
MCUDevelopment and Market Scale
MCU (Micro ...read more
February_Heterogeneous Integration｜Heterogeneous Integration Application Driven Semiconductor Business Opportunity Analysis
The expanded application of heterogeneous integration will be favorable to the vigorous development of advanced packaging technology. Compared with traditional packaging, advanced packaging adds sputtering, coating/development, exposure, plating, lamination, stripping, bonding and other processes. ...read more
February_Heterogeneous Integration｜Analysis of Important Process Technology Development Trend of Advanced Packaging(Next)
Terminal products are the main driving force for the development of advanced packaging technology. In recent years, with the commercialization of applications such as the Internet of Things, big data, 5G communications, artificial intelligence, self-driving cars and smart manufacturing, semiconductor manufacturing has been prompted by ...read more
February_Heterogeneous Integration｜Analysis of Important Process Technology Development Trend of Advanced Packaging(Up)
The evolution of semiconductor packaging technology is based on the year 2000 as a development node, before the traditional packaging technology can be divided into three stages of development, the 1970s for the through-hole insert (Through Ho). ...read more
