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Technology2022-09-15t10:58:40+08:00

Catalog

October_Advanced Packaging Equipment Material|Importance of 2.5D/3D Packaging and Critical Process Points(Next)

2024/11/14|

The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, using the intermediary layer as a bridge to connect each wafer and provide high-speed communication interfaces. ...read more

October_Advanced Packaging Materials|Semiconductor Industry Driven by US-China Technology War

2024/10/28|

Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war started with trade friction and gradually shifted to national security and technological leadership. ...read more

September_Panel Level Packaging Special|Global Overview of Fan-out Panel Level Packaging Supply Chain Development

2024/10/02|

Equipment and materials are the key pillars driving the development of the market and the industry, according to market research organization Yole Développement estimates that the global fan-out packaging equipment and materials in 2024 will be the largest in the world. ...read more

September_Panel Level Packaging|Fan Out Panel Level Packaging (FOPLP) Market and Technology Development Overview

2024/10/01|

According to a report published by Yole Développement, a market research firm, the global fan-out packaging market will reach USD 1.86 billion in 2022 and is estimated to reach USD 1.86 billion by 2026. ...read more

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