Catalog
December_Special Topics｜Trump 2.0: Possible Impacts on TSMC
Market Conditions Before and After Trump's Election
Trump was elected as the new U.S. President and is expected to return to power in January 2025 with experience and an absolute majority. ...read more
December_Industry Review｜Jishengger stepping down, where does Intel go from here?
Main news content:
U.S. chip maker Intel has announced that former CEO Pat Gelsing has been appointed to the board of directors of the company. ...read more
October_Advanced Packaging Equipment Material｜Importance of 2.5D/3D Packaging and Critical Process Points(Next)
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, using the intermediary layer as a bridge to connect each wafer and provide high-speed communication interfaces. ...read more
October_Advanced Packaging Equipment Material｜Importance of 2.5D/3D Packaging and Critical Process Points(Up)
2.5D/3DWhy is packaging the mainstay of wafer fab production and why is it important?
19 ...read more
October_Advanced Packaging Materials｜Semiconductor Industry Driven by US-China Technology War
Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war started with trade friction and gradually shifted to national security and technological leadership. ...read more
September_Panel Level Packaging Special｜Global Overview of Fan-out Panel Level Packaging Supply Chain Development
Equipment and materials are the key pillars driving the development of the market and the industry, according to market research organization Yole Développement estimates that the global fan-out packaging equipment and materials in 2024 will be the largest in the world. ...read more
September_Panel Level Packaging｜Fan Out Panel Level Packaging (FOPLP) Market and Technology Development Overview
According to a report published by Yole Développement, a market research firm, the global fan-out packaging market will reach USD 1.86 billion in 2022 and is estimated to reach USD 1.86 billion by 2026. ...read more
September_Panel Level Packaging｜Global Fan-Out Panel Level Packaging (FOPLP) Development Status
As advanced processes in the front-end of the semiconductor industry are approaching their physical limits, relying on smaller component sizes to improve their operational capabilities is bound to face rising production costs, so the global semiconductor industry has turned to advanced packaging as a way to improve their performance. ...read more
September_Wi-Fi 7｜Global Wi-Fi 7 Market and Technology Development Analysis
Wi-Fi 7 (IEEE 802.11be) is the latest generation of wireless networking technology, with a draft standard available in 2021, and a full version and associated certifications available in 2024. ...read more
