An integrated optical circuit is an optoelectronic device that integrates LDs, PDs, modulators, gate couplers, waveguides, and other optoelectronic components into a single chip, although it was first proposed by Bell Labs in 1969. ... Read more
Since the mainstream in 2025 will still be traditional optical modules, we will analyze and discuss the industry chain of traditional pluggable optical communication modules. The industry chain can be divided into upstream components. ... Read more
With the launch of OpenAI's O-series models, DEEPSEEK's R1, and xAI's Grok3, a new generation of generative models with logical reasoning capabilities, OpenAI is now able to offer a new generation of generative models with logical reasoning capabilities. ... Read more
Analyzing the Global Theme Park Layout and Aiming at the New Trend of Global Physical Entertainment Industry With the Chinese New Year of 2025 just passed, I believe many people are busy planning their next overseas trip. ... Read more
CES (Consumer Electronics Show) is organized by the Consumer Technology Association and is the world's largest consumer electronics show. ... Read more
2025 Technology/Semiconductor Executive Summary As the year 2024 comes to an end and we are about to welcome the arrival of 2025, Chipo observes that the global economy next year should be in the ... Read more
Market Conditions Before and After Trump's Election Trump's election as the new U.S. President and his expected return to power in January 2025, with his experience and absolute majority in Congress, will surely have a negative impact on Taiwan. ... Read more
Key News: U.S. chip maker Intel announced that former CEO Pat Gelsinger, who was appointed to the board on December 1, has been removed from the company's board of directors. ... Read more
The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and with the current AI and Large Language Modeling LLM (large lang ... Read more
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, which uses an intermediary layer as a bridge to connect each wafer and provide a high-speed communication interface. ... Read more
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