The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and with the current AI and Large Language Modeling LLM (large lang ... Read more
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, which uses an intermediary layer as a bridge to connect each wafer and provide a high-speed communication interface. ... Read more
Why is 2.5D/3D packaging the mainstay of wafer fab production and why is it important? After the world's first integrated circuits were created in 1958, the performance of wafers was ... Read more
Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war began with trade friction and gradually turned to national ... Read more
Equipment and materials are the key pillars driving the development of the market and the industry. According to market research organization Yole Développement, it is estimated that by 2024, the entire market will have a total of 1.5 million tons of equipment and materials. ... Read more
According to a report published by Yole Développement, the global fan-out packaging market size is 1.86 billion by 2022. ... Read more
As advanced processes in the front-end of semiconductors are approaching their physical limits, relying on smaller component sizes to improve their operational capabilities is bound to face rising production costs. ... Read more
Wi-Fi 7, (IEEE 802.11be) is the latest generation of wireless networking technology, with a draft standard available in 2021, and a full version and associated ... Read more
Apple held a press conference on September 10th at 1:00 am Taiwan time, where it unsurprisingly announced the new generation of iPhone 16 series phones, Ap ... Read more
Linear Driven Pluggable Optics (LPO) LPO technology seems to be a mature but transitional product that can reduce power consumption without replacing the pluggable architecture. ... Read more
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