The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, using the intermediate layer as a bridge to connect the wafers and provide high-speed communication interfaces, an arrangement that allows for more flexibility in a single package. This arrangement allows for more flexibility in a single package. The technology involves the integration of silicon intermediates and TSVs, and wafers are typically connected to the intermediates using MicroBump technology. The 2.5D format is ideal for larger wafer sizes and higher pin densities, and wafers are usually mounted on substrates in flip-chip form. The 2.5D package can enhance the performance and minimize the cost compared to the traditional (2D) package.