Semiconductor packaging is a very fragile wafer wrapped in an outer shell and connected to the wire for use, so it has the effect of protecting the wafer, power supply, signal interconnection, heat dissipation and so on. The packaging industry is booming due to the continuous increase in wafer production, and is driven by the requirements for lightweight, thin, short, small, and high-performance electronic products, which have led to the continuous advancement of packaging technologies. According to a report released by ITRI IEK, benefiting from the Covid-19 epidemic triggered by the residential economy demand driven by the significant increase in the sales of communication products, the resulting chip shortage phenomenon pushed up the price of some packaging and testing products, making the global semiconductor packaging and testing industry in 2021, an annual increase in output value of 23.2%, amounting to 36.9 billion U.S. dollars. With the 5G communication, electric vehicles and other new technology market penetration rate continues to expand, so that the global packaging and testing output value to show growth, according to market research firm CINNO Research released data, the world's top ten outsourcing packaging and testing foundry (OSAT) in the first half of 2022, total revenue of 17.5 billion U.S. dollars, an annual increase of 16.7%, as listed in Table 1, of which five are Taiwan companies.

Table 1: Global Top 10 Outsourcing Foundries in the First Half of 2022

Source : CINNO Research