• Co-packaged Optics (CPO)

Co-packaged optical technology has been developed for the application of silicon photonic chips in optical signaling modules. ...read more

Continuing the market analysis of optical communication modules in the previous two articles, we will now discuss the current trends and status of the important technology development of optical communication. Due to the rise of generative AI, data center investment has become a major trend. ...read more

At present, the status of silicon photonics implantation in the market is not yet clear, and there are many tug-of-war in the market, such as the specification? What is the mainstream technology? Whether or not the survival of the original optical engine component manufacturers will be compressed, and so on. Therefore, we ...read more

Last October, we published a series of silicon photonics and co-packaging special reports. As AI's demand for hardware computing power continues to rise, so does the demand for data transmission, whether it's 800G puts ...read more

Although Sora has demonstrated many extraordinary movie generation capabilities, there are still some weaknesses, such as the inability to fully simulate the physics of complex scenes, understand specific cause-and-effect relationships, handle spatial details, and accurately characterize ...read more

On February 15, 2024 OpenAI announced the launch of Sora, a new milestone in the development of video-generative AI technology that produces smooth, lifelike videos of up to one minute in length. According to the company ...read more

Currently, the vast majority of visual generative AI belongs to the multimodal model, which realizes cross-domain information processing and interaction by learning multimodal connections from data, including text-to-graphics, text-to-3D objects, and so on. ...read more

Since the launch of OpenAI's chatbot ChatGPT in November 2022, the generative AI boom has attracted many vendors to develop related technologies and applications, and has created a huge impact on the development of various ...read more

TSMC's Technology Forum this year consisted of eight sessions, the first of which was held on 4/24 in North America, where the latest process technologies, advanced packaging technologies, etc. were revealed. ...read more