March_Optical Communication｜Integrated Photonics Market and Technology Development Overview
作者：智璞產業趨勢研究所執行副總 林偉智 積體光路是將LD、PD、調變器、光柵耦合器、波導等光電元件集成於單顆 ... Read more
March_Optical Communication｜Plug-in Optical Communication Module Market and Technology Development Overview(M)
作者：智璞產業趨勢研究所執行副總 林偉智 由於2025年主流還是傳統光模塊，因此我們對傳統可插拔光通訊模組產業 ... Read more
March_Optical Communication｜Plug-in Optical Communication Module Market and Technology Development Overview(Top)
作者：智璞產業趨勢研究所執行副總 林偉智 隨著OpenAI推出O系列模型、DEEPSEEK的R1以及xAI的G ... Read more
February_Entertainment Industry｜Analyzing the global theme park layout, aiming at the new trend of global physical entertainment industry
作者：智璞產業趨勢研究所執行副總 林偉智 解析全球主題樂園佈局，瞄準全球實體娛樂產業新趨勢 2025年農曆新年 ... Read more
January_CES 2025 Feature｜Swimming in the World of AI Technology
作者：智璞產業趨勢研究所執行副總 林偉智 CES（Consumer Electronics Show）是由美國 ... Read more
December_2025 Trend Forecast｜Technology Semiconductor Key Trend Forecasts
2025 Technology/Semiconductor Executive Summary As the year 2024 comes to an end and we are about to welcome the arrival of 2025, Chipo observes that the global economy next year should be in the ... Read more
December_Special Topics｜Trump 2.0: Possible Impacts on TSMC
Market Conditions Before and After Trump's Election Trump's election as the new U.S. President and his expected return to power in January 2025, with his experience and absolute majority in Congress, will surely have a negative impact on Taiwan. ... Read more
December_Industry Review｜Jishengger stepping down, where does Intel go from here?
Key News: U.S. chip maker Intel announced that former CEO Pat Gelsinger, who was appointed to the board on December 1, has been removed from the company's board of directors. ... Read more
November_Advanced Packaging Materials｜Advanced Packaging CoWos Taiwan Supply Chain Overview
The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and with the current AI and Large Language Modeling LLM (large lang ... Read more
October_Advanced Packaging Equipment Material｜Importance of 2.5D/3D Packaging and Critical Process Points(Next)
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, which uses an intermediary layer as a bridge to connect each wafer and provide a high-speed communication interface. ... Read more
