Key News: U.S. chip maker Intel announced that former CEO Pat Gelsinger, who was appointed to the board on December 1, has been removed from the company's board of directors. ... Read more

The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and with the current AI and Large Language Modeling LLM (large lang ... Read more

The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, which uses an intermediary layer as a bridge to connect each wafer and provide a high-speed communication interface. ... Read more

Why is 2.5D/3D packaging the mainstay of wafer fab production and why is it important? After the world's first integrated circuits were created in 1958, the performance of wafers was ... Read more

Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war began with trade friction and gradually turned to national ... Read more

Equipment and materials are the key pillars driving the development of the market and the industry. According to market research organization Yole Développement, it is estimated that by 2024, the entire market will have a total of 1.5 million tons of equipment and materials. ... Read more

According to a report published by Yole Développement, the global fan-out packaging market size is 1.86 billion by 2022. ... Read more

As advanced processes in the front-end of semiconductors are approaching their physical limits, relying on smaller component sizes to improve their operational capabilities is bound to face rising production costs. ... Read more

Wi-Fi 7, (IEEE 802.11be) is the latest generation of wireless networking technology, with a draft standard available in 2021, and a full version and associated ... Read more

Apple held a press conference on September 10th at 1:00 am Taiwan time, where it unsurprisingly announced the new generation of iPhone 16 series phones, Ap ... Read more