Author: Wei-Zhi Lin, Executive Vice President, Ji-Pu Industrial Trend Research Institute The integrated optical circuit is a single cell that integrates LDs, PDs, modulators, raster couplers, waveguides, and other optoelectronic components into a single optical circuit. ... Read more
Author: Wei-Chi Lin, Executive Vice President, Ji-Pu Industry Trend Research Institute Since the mainstream in 2025 will still be traditional optical modules, we are interested in the traditional pluggable optical communication module industry. ... Read more
Author: Wei-Chi Lin, Executive Vice President, Ji-Pu Industrial Trend Research Institute With the launch of OpenAI's O-series models, DEEPSEEK's R1, and xAI's G ... Read more
Author: Mr. Lin Wei Zhi, Executive Vice President of Ji-Pu Industry Trend Research Institute, analyzes the layout of global theme parks and aims at the new trend of global physical entertainment industry 2025 Chinese New Year ... Read more
Author：Lin Wei Zhi, Executive Vice President of Ji-Pu Industry Trend Research Institute CES (Consumer Electronics Show) is a trade show organized by the United States of America. ... Read more
2025 Technology/Semiconductor Executive Summary As the year 2024 comes to an end and we are about to welcome the arrival of 2025, Chipo observes that the global economy next year should be in the ... Read more
Market Conditions Before and After Trump's Election Trump's election as the new U.S. President and his expected return to power in January 2025, with his experience and absolute majority in Congress, will surely have a negative impact on Taiwan. ... Read more
Key News: U.S. chip maker Intel announced that former CEO Pat Gelsinger, who was appointed to the board on December 1, has been removed from the company's board of directors. ... Read more
The trend of AI in the past few years has made 2.5D/3D packaging a hot topic, and with the current AI and Large Language Modeling LLM (large lang ... Read more
The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, which uses an intermediary layer as a bridge to connect each wafer and provide a high-speed communication interface. ... Read more
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