• Co-packaged Optics (CPO)

In order to apply silicon photonics chips to optical signaling modules, co-encapsulation optical technology has been developed. It is a technology that encapsulates silicon photonics and transducer chips into a single component in order to shorten the signal transmission path, thereby increasing the transmission rate and reducing power consumption. There are three types of packages developed: 2D, 2.5D, and 3D. The 2D package is a silicon photonics and a switch chip laminated on a carrier board, and the two are connected through carrier board wiring or metal wires, and the package is in the form of a crystal lamination or wire bonding package.