TSMC's Technology Forum this year consisted of eight sessions, the first of which was held on 4/24 in North America, where the latest process technologies, advanced packaging technologies, etc. We will take the first session of this year's Technology Forum to look at the development trend of cutting-edge manufacturing technologies. We know that semiconductors have always been driven by end-demand, whether it is the past Moore's Law era with networking, personal computers, or mobile communications, or the post-Moore era with Artificial Intelligence (AI) computing power.