Currently, silicon photonics technology is usually fabricated on SOI wafers containing important optoelectronic components such as a laser source that converts electrical signals into optical signals, an optical sensor that converts optical signals into electrical signals, a modulator that enhances the bandwidth of the optical signals, a planar waveguide that transmits the optical signals, and an optocoupler that assists in reading the optical signals from the wafer. FIG. 1 is a cross-sectional view of a silicon photonic wafer whose components include.

(1). Optical components such as lenticular couplers and waveguides that utilize silicon as a light-conducting layer;

(2). Optoelectronic devices such as modulators and sensors that utilize doping to form a PN interface;

(3). A laser source utilizing III-V epitaxial diaphragms laminated to a silicon SOI substrate, and covered with deposited silicon dioxide to form a strong wave-conducting structure after the completion of the component, and an overview of the technological development of the important components is described as follows.