February_Heterogeneous Integration｜Heterogeneous Integration Application Driven Semiconductor Business Opportunity Analysis

Published On: 2023/02/01|Categories: 科技(Technology)|

The expanded application of heterogeneous integration will be favorable to the vigorous development of advanced packaging technology. Compared with traditional packaging, advanced packaging adds sputtering, coating/development, exposure, plating, lamination, stripping, and bonding processes, which will drive related equipment and material business opportunities. In terms of equipment, sputtering equipment is used for the barrier layer of deposition bumps and the conductive layer for plating. Important suppliers include Canon, ULVAC, Applied Materials, KLA (merged SPTS), Lam Research, ASM Pacific (merged NEXX), Evatec (merged Oerlikon), Tango, and others. (acquired Oerlikon), Tango, etc. Coating and developing equipments are used to evenly distribute the reconstructed layer material and photoresist on the wafer and to form a pattern respectively. Important suppliers include SUSS, EVG, TEL, SCREEN and Tazmo. Micrographic equipment is used to expose the reconstructed layer materials and photoresist patterns. Important suppliers include Canon, Nikon, ORC, Hakuto, USHIO, Onto (merged with Rudolph), Veeco (merged with Ultratech), SUSS, and EVG. Plating equipment is used for rapid deposition of copper wires and bumps. Important suppliers include Applied Materials, Lam Research, ASM Pacific (merged with NEXX), and EBARA. Stripping equipment removes temporary bonding materials by means of heating and sliding, mechanical separation, laser separation, etc. Important suppliers include EVG, SUSS, ERS, TEL, Nitto, TOK, and Tazmo. Bonding equipment is used for wafer-to-wafer and chip-to-wafer bonding. Important suppliers include EVG, SUSS, Besi, ASM Pacific, Toray, and Shibaura. Taiwan's suppliers of the aforementioned equipment include Li-Ding and Tianhong for sputtering, Yi-Li-Xin for coating/development, Hong-Plastic and Xin-Wei for plating, Jun-Hua for bonding, and Qin-You for stripping. According to the report published by Yole Développement, the estimated market size of these equipment in fan-out packaging in 2024 and the compound growth rate from 2018 to 2024 are listed in Table 6.

Table 6: Key Equipment Market Size and Growth of Fan-out Packaging

Source : Yole Développement

在材料部分，重構層材料是液體或厚膜型態的感光有機材料，分別以旋轉塗佈、真空壓膜等方式貼附在晶圓上，重要供應商有DuPont、Merck、Nippon Kayaku、JSR、TOK、ShinEtsu、Sumitomo Bakelite、HD Microsystems、Ajinomoto等公司。光阻是用於定義出導線與凸塊區域，並保護其他區域不會被蝕刻，重要供應商有JSR、Merck、Tok等公司。電鍍液是用於沉積導線與凸塊之金屬層的化學藥劑，重要供應商有DuPont、MacDermid Enthone、Moses Lake Industries、Uyemura等公司。台灣有供應前述材料的廠商包括電鍍液的添鴻、重構層材料的達興、光阻的永光。根據市場Yole Développement發布的報告指出，預估2024年這些材料在扇出型封裝的市場規模與2018~2024年複合成長率如表7所列。

表7、扇出型封裝的重要材料市場規模與成長性