The expanded application of heterogeneous integration will be favorable to the vigorous development of advanced packaging technology. Compared with traditional packaging, advanced packaging adds sputtering, coating/development, exposure, plating, lamination, stripping, and bonding processes, which will drive related equipment and material business opportunities. In terms of equipment, sputtering equipment is used for the barrier layer of deposition bumps and the conductive layer for plating. Important suppliers include Canon, ULVAC, Applied Materials, KLA (merged SPTS), Lam Research, ASM Pacific (merged NEXX), Evatec (merged Oerlikon), Tango, and others. (acquired Oerlikon), Tango, etc. Coating and developing equipments are used to evenly distribute the reconstructed layer material and photoresist on the wafer and to form a pattern respectively. Important suppliers include SUSS, EVG, TEL, SCREEN and Tazmo. Micrographic equipment is used to expose the reconstructed layer materials and photoresist patterns. Important suppliers include Canon, Nikon, ORC, Hakuto, USHIO, Onto (merged with Rudolph), Veeco (merged with Ultratech), SUSS, and EVG. Plating equipment is used for rapid deposition of copper wires and bumps. Important suppliers include Applied Materials, Lam Research, ASM Pacific (merged with NEXX), and EBARA. Stripping equipment removes temporary bonding materials by means of heating and sliding, mechanical separation, laser separation, etc. Important suppliers include EVG, SUSS, ERS, TEL, Nitto, TOK, and Tazmo. Bonding equipment is used for wafer-to-wafer and chip-to-wafer bonding. Important suppliers include EVG, SUSS, Besi, ASM Pacific, Toray, and Shibaura. Taiwan's suppliers of the aforementioned equipment include Li-Ding and Tianhong for sputtering, Yi-Li-Xin for coating/development, Hong-Plastic and Xin-Wei for plating, Jun-Hua for bonding, and Qin-You for stripping. According to the report published by Yole Développement, the estimated market size of these equipment in fan-out packaging in 2024 and the compound growth rate from 2018 to 2024 are listed in Table 6.

Table 6: Key Equipment Market Size and Growth of Fan-out Packaging

Source : Yole Développement