In recent years, the commercialization of applications such as the Internet of Things, big data, 5G communications, artificial intelligence, self-driving cars, and smart manufacturing has prompted semiconductor manufacturers to actively introduce advanced packaging technologies to meet customer demand for thinner and lighter wafers with faster data processing speeds and lower power losses. Therefore, the market mainly comes from computer and mobile device processors with complex functions and high-speed computation. As shown in Figure 2, the most powerful CPU/GPU will be the first to introduce the most advanced 2.5D/3D packaging technology in 2020, while the packaging technology used for mobile device processor ICs and RF ICs will lag behind by two or three generations respectively, and automotive ICs, which are simple in functionality but require higher weather resistance, will continue to utilize traditional packaging technology.

Figure 2: Changes in Semiconductor Packaging Technology for Different End Products

Source : KLA Tenco