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November_FPGA Topics｜Global FPGA Technology Development Overview(Next)
In terms of technology development, FPGAs were developed to replace ASICs. Before 2000, FPGA vendors generally converted the logic cell capacity of their products into gate poles to make it easier for customers to compare their products. ...read more
November_FPGA Topics｜Global FPGA Technology Development Overview(Up)
There are many different types of FPGAs on the market, and their infrastructure mainly consists of three parts: the programmable logic unit, the programmable I/O unit, and the internal connectors, etc. The programmable logic unit consists of a set of data searching, and the programmable logic unit consists of a set of data searching. ...read more
November_FPGA Topics｜Worldwide FPGA Market Status Discussion(Next)
According to Data Intelo, the market size of FPGA applications in 2027 is estimated to be 29% for automotive, 24% for communications, and 19% for industrial applications in descending order. ...read more
November_FPGA Topics｜Worldwide FPGA Market Status Discussion(Up)
The positioning of FPGAs is often questioned as not being able to compete with ASICs, and it is argued that the market is difficult to grow or even shrink because of high development costs and usually small volumes. First of all, it cannot be denied that F ...read more
November_FPGA Topics｜FPGA History and Product Positioning
What is a Field Programmable Gate Array (FPGA)? Before we talk about this, we need to talk about the logic components. ...read more
October_Silicon Photonics Co-packaging｜Global Co-packaging Optical Technology Development Overview(Next)
Currently, most of the optical signal input and output in co-packaged optics use edge couplers. The use of V-slot can simultaneously reduce the alignment error and transmission loss requirements, so that the signal loss from the fiber to the silicon photonics chip can be controlled within -1%. ...read more
October_Silicon Photonics Co-packaging｜Global Co-packaging Optical Technology Development Overview(Up)
To date, traditional pluggable optical modules have been developed in GBIC, SFP, XFP, QSFP, CFP, OSFP, etc. GBIC is an intermateable product that meets the international standards and can be ...read more
October_Silicon Photonics Co-packaging｜Taiwan Co-packaging Optics Industry Development Overview
Although silicon photonics technology has been developed for more than 20 years, it is only in the past two years that the huge data transmission demand driven by the rise of generative AI has been explored and emphasized, and therefore its technology and the derived co-packaging optics, the market, and the development of silicon photonics technology have become more and more important. ...read more
October_Silicon Photonics Co-packaging Feature｜Global Co-packaging Optics Market(Next)
Currently, the vendors that are developing co-packaged optics-related technologies and products include Ayar Labs, Broadcom, Cisco, Intel, Lumentum, Marvel, and others. ...read more
