Currently, most of the optical signal inputs and outputs in co-packaged optics use edge couplers. The use of V-slot can simultaneously reduce the alignment error and transmission loss requirements, so that the signal loss from the optical fiber to the silicon photonics chip is controlled within -1.5 dB, and the use of thermal phase shifters can further improve the alignment accuracy. In addition, since the performance of some of the optical components in the silicon photonics chip is highly susceptible to the high temperature variations generated by the switch chip, co-packaged optical modules are usually cooled by either air or liquid cooling devices, the latter of which has a better cooling effect due to its low operating noise, even heat dissipation, and the lack of an additional power supply for the fan. Intel's liquid cooling solution can reduce the temperature of co-packaged optical modules by 35°C.