In the past few years, the trend of AI has made 2.5D/3D packaging become the most popular fried chicken, with the development of AI and large language model LLM (large language model), although the speed of pre-training Pre Training has slowed down the phenomenon, but Reinforcement Learning (Reinforcement learning) progress and expansion is about to begin; in addition, the launch of DeepSeek R1 model this Chinese New Year shocked Wall Street for a few days, they did come up with innovative model optimization and calculator configuration optimization, which is an innovative model optimization and calculator configuration optimization, which is a good idea for the development of AI. Expansion is just about to begin; in addition, in this year's Chinese New Year launched the DeepSeek R1 model shocked Wall Street for a few days, they did put forward an innovative model optimization and optimization of the calculator configuration, which is likely to make the ecosystem a little bit of a change. However, at a time when AGI, the general-purpose AI model, is not yet available, we don't think that DeepSeek's emergence will bring down the demand for ICs, but will instead bring up the demand for ICs (not only GPUs, but also CPUs, NPUs, ASICs, FPGAs, etc.), which will continue to push up the demand for advanced packages. From the end of 2024 to February 2025, the entire market demand for TSMC's CoWoS for the whole year will remain hot even in 2026, which shows that the current market still prefers to err on the side of letting go.

Among 2.5D ICs, the most representative is TSMC's CoWoS technology. It was in 2009 that TSMC's then Senior Vice President of Research and Development, Mr. Shang-Yi Chiang, and his R&D staff discovered that advanced packaging could make up for the loss of speed in data transmission on the chip. At the time of the launch of this technology, due to the complexity of the equipment used in this technology, the price is not compared to the advanced manufacturing process, so for foreign investors in the international community is like "killing the chicken with a bull's-eye," coupled with the fact that at that time, no one could see the commercial potential of CoWoS, many foreign companies are reluctant to cooperate with the provision of equipment, which in turn, Taiwan's equipment vendors to open up a path of opportunity. CoWoS technology can be divided into "CoW" and "WoS", as shown in Fig. 1 and Fig. 2 (organized for CoWoS-S), and its overall process relies on a variety of equipment, such as crystal picking equipment and dispensers,