2.5D/3DWhy is packaging the mainstay of wafer fab production and why is it important?

Since the world's first integrated circuit was born in 1958, the performance of chips has depended on transistor miniaturization. However, as device size approaches its physical limits, process node is becoming a commercial marketing term. Using advanced processes to shrink devices no longer brings cost reductions, but rather increases costs significantly due to the difficulty of shrinking. As the demand for transistor density and chip performance continues to rise, advanced packaging technology has become an important solution. Advanced packaging technology shifts the wafer architecture to a combination of horizontal and vertical stacking of more wafers, which becomes a necessary technology to continue Moore's Law.

Conventional packaging is a combination of flat type wire bonding and