半導體產業日報

精選深度分析

今日快訊

• 台積電拚面板封裝 原料、零組件、設備廠等入列 相關類股喊衝韓媒ETNews披露，台積電衝刺面板級封裝（PLP）技術，正揪伴打造相關原料、零組件、設備供應鏈，以建立量產系統。業界認為，台積電領頭下，將掀起面板級封裝熱潮，帶旺日月光投控、力成、群創、志聖、欣興、… 先進封裝 · 經濟日報科技版
• 韓媒指台積電面板級封裝最快明年量產 業界：消息有誤 先進封裝 · 經濟日報科技版
• 台積揪伴衝面板級封裝 韓媒：已爭取到全球 AI 晶片客戶韓媒ETNews報導，台積電衝刺面板級封裝（PLP）技術，正在揪伴打造相關原料、零組件、設備供應鏈，以建立量產系統，為先進封裝「以方代圓」做好準備，並已爭取到全球AI晶片客戶，最快可能在2027年量產… 先進封裝 · 經濟日報科技版
• 《半導體》外資點火聯發科！AI ASIC上行循環剛開始、2028還有戲 – 富聯網 訂單動態 · Google News – 聯發科(公司)
• SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead 訂單動態 · DigiTimes
• Jun 15Samsung’s Exynos 2600 doubles on-device AI performance in MLPerf benchmarksSamsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results released in June 2026. The company said the chip, manufactured on a 2nm foundry process and slated for Galaxy S26 standard and Plus models in early 2026, showed broad gains across natural language processing and image-generation workloads. 製程技術 · DigiTimes
• Jun 15South Korea’s chip equipment players ride the HBM4 waveSouth Korea’s semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new contracts and revenue rebounds for domestic suppliers, according to executives and industry reporting. 材料設備 · DigiTimes
• New AI demand puts Micron HBM3E chips in the spotlight – AD HOC NEWS 訂單動態 · Google News – HBM
• From CoWoS to CoPoS, Taiwan Semiconductor’s glass substrate verification has broken through the packaging performance bottleneck. – Moomoo 先進封裝 · Google News – CoWoS CoPoS
• 1分鐘讀財經》台積電AI封裝下個戰場！「CoPoS秘密測試中」3設備廠成大贏家- 要聞 – 中時新聞網 先進封裝 · Google News – 先進封裝