Author: Mr. Lin Weizhi, Executive Vice President, Ji-Pu Industrial Trend Research Institute

As the training scale of generative AI and large-scale language models continues to expand, data centers are rapidly moving to the 100,000 or even million gas pedal node level. As cluster scale breaks through traditional design assumptions, the system bottleneck no longer comes from the power of a single chip, but from the efficiency of data exchange between nodes and the overall energy structure. The power consumption, heat density and stability of the interconnect system directly determine the economic value and sustainability of the overall computing platform. Against this backdrop, the power and space pressures of traditional plug-and-play pluggable optics are gradually surfacing, and therefore, optoelectronic packaging (CPO) has been recognized as one of the most cost-effective solutions for the interconnect.