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U.S. chip maker Intel has announced that former CEO Pat Gelsing has been appointed to the board of directors of the company. ...read more

The 2.5D packaging technology is in between the traditional 2D packaging and the mature 3D packaging, using the intermediary layer as a bridge to connect each wafer and provide high-speed communication interfaces. ...read more

2.5D/3DWhy is packaging the mainstay of wafer fab production and why is it important?

19 ...read more

Since 2018, the U.S.-China technology war has gradually escalated, and the competition between the two countries in the field of technology has become a global focus. This technology war started with trade friction and gradually shifted to national security and technological leadership. ...read more

Equipment and materials are the key pillars driving the development of the market and the industry, according to market research organization Yole Développement estimates that the global fan-out packaging equipment and materials in 2024 will be the largest in the world. ...read more

According to a report published by Yole Développement, a market research firm, the global fan-out packaging market will reach USD 1.86 billion in 2022 and is estimated to reach USD 1.86 billion by 2026. ...read more

As advanced processes in the front-end of the semiconductor industry are approaching their physical limits, relying on smaller component sizes to improve their operational capabilities is bound to face rising production costs, so the global semiconductor industry has turned to advanced packaging as a way to improve their performance. ...read more

Wi-Fi 7 (IEEE 802.11be) is the latest generation of wireless networking technology, with a draft standard available in 2021, and a full version and associated certifications available in 2024. ...read more

Apple held a press conference on September 10th at 1:00 AM Taiwan time, in which it unsurprisingly announced a new ...read more