Equipment and materials are important pillars to promote the development of the market and industry. According to market research firm Yole Développement, the global fan-out packaging equipment and materials market is estimated to reach over US$700 million in 2024, of which the share of wafer-level packaging equipment and materials will be 49% and 34%, and that of panel packaging equipment and materials will be 10% and 7%, accounting for about US$70 million and US$49 million, respectively. 10% and 7% respectively, amounting to US$70 million and US$49 million. The core equipment for fan-out panel level packaging process includes exposure, sputtering, plating, solid crystal, mold sealing and other machines, which are described as follows.

• Exposure equipment: UV light is used to irradiate the photoresist and then combined with the developing process to form the desired pattern, which is used to produce redistributed layers, through holes and bumps. Because the exposure accuracy and resolution is micron level, laser direct writing or step exposure machine can be used. The former does not require a photomask but has poorer accuracy, the main suppliers are SUSS, Adtec, Screen, ORC, Orbotech; the latter has better accuracy but expensive equipment, the main suppliers are
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