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Table 1: Leading Manufacturers of Advanced Packaging Technologies<\/p>\n
![\"\"](\"https:\/\/witology.com.tw\/wp-content\/uploads\/2023\/01\/20230131-2-300x133.png\")
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Source : IEEE<\/p>\n
The evolution of semiconductor packaging technology is based on the year 2000 as the development node, before the traditional packaging technology can be subdivided into three stages of development, the 1970s for the Through Hole Packaging (Through Hole) era, the representative package type is a DIP with pin pins on both sides, which are soldered to the printed circuit board through the jack and wave soldering process; the 1980s for the Surface Mount Technology (SMT) era, the representative package type is a QFP, SOP, LCC with wing or ding shaped pins on two or four sides, which are soldered to the printed circuit board through the surface mounting process; the 1990s for the SMT era. In the 1980s, it was the SMT (Surface Mounting) era, and the representative package types were QFP, SOP, and LCC, which had wing or ding shaped pins coming out from two or four sides, and were soldered to PCBs through the SMT process; in the 1990s, it was the Array Packaging era, and the representative package types were PGA and BGA, which had solder balls at the bottom instead of pins\/wires, and could increase the number of connections to PCBs dramatically.<\/p>\n
2000\u5e74\u5f8c\u9032\u5165\u5148\u9032\u5c01\u88dd\u4e16\u4ee3\uff0c\u521d\u671f\u7684\u6676\u7247\u7d1a\u5c01\u88dd(Chip Size Package\uff1bCSP)\u4ecd\u662f\u55ae\u6676\u7247\u5c01\u88dd\uff0c\u4f46\u5c3a\u5bf8\u4e0d\u8d85\u904e\u6676\u7247\u9762\u7a4d\u7684120%\u4ee5\u7b26\u5408\u96fb\u5b50\u7522\u54c1\u8f15\u8584\u77ed\u5c0f\u7684\u6f6e\u6d41\u3002\u4e4b\u5f8c\u767c\u5c55\u7684\u7cfb\u7d71\u7d1a\u5c01\u88dd(System in a Package\uff1bSiP)\u958b\u59cb\u5c07\u591a\u7a2e\u529f\u80fd\u6676\u7247\u96c6\u6210\u5728\u55ae\u4e00\u5c01\u88dd\u5143\u4ef6\u5167\uff0c\u4ee5\u8f03\u4f4e\u6210\u672c\u9054\u5230\u5982\u540c\u7cfb\u7d71\u7d1a\u6676\u7247(System On a Chip\uff1bSoC)\u7684\u6548\u7528\u3002\u63a5\u8457\u63a8\u51fa\u7684\u5c64\u758a\u5c01\u88dd(Package on Package\uff1bPoP)\u662f\u5c07\u5169\u500b\u4ee5\u4e0a\u5143\u4ef6\u63a1\u5782\u76f4\u5806\u758a\u65b9\u5f0f\u518d\u5c01\u88dd\u6210\u66f4\u5927\u7684\u5143\u4ef6\u3002\u5f8c\u7e8c\u767c\u5c55\u7684\u6676\u5713\u7d1a\u5c01\u88dd(Wafer Level Package\uff1bWLP)\u5927\u5e45\u6539\u8b8a\u88fd\u7a0b\uff0c\u5b83\u5148\u5728\u6676\u5713\u4e0a\u9032\u884c\u5c01\u88dd\u3001\u6e2c\u8a66\u5f8c\u518d\u5207\u5272\u6210\u5143\u4ef6\uff0c\u5176\u5c3a\u5bf8\u7b49\u540c\u6676\u7247\u30022010\u5e74\u5f8c\u671d\u5411\u7acb\u9ad4\u5316\u767c\u5c55\uff0c\u5148\u5f8c\u958b\u767c\u51fa2.5D\u82073D\u5c01\u88dd\u6280\u8853<\/a>\u3002\u6839\u64da\u570b\u969b\u96fb\u6a5f\u96fb\u5b50\u5de5\u7a0b\u5b78\u6703\u767c\u5e03\u7684\u5831\u544a\u6307\u51fa\u76ee\u524d\u5404\u6280\u8853\u9818\u5c0e\u5ee0\u5546\u5982\u6240\u88682\u6240\u5217\u3002<\/p>\n <\/p>\n Table 1: Leading Manufacturers of Advanced Packaging Technologies<\/p>\n Source : IEEE<\/p>\n<\/p>\n