1.0Witology Market Trend Research Institutehttps://witology.com.tw/en智璞https://witology.com.tw/en/post/author/witology/八月_半導體專題｜先進封裝技術在高性能運算晶片應用狀況剖析(中) - 智璞產業趨勢研究所rich600338<blockquote class="wp-embedded-content" data-secret="3MBRdyJVUZ"><a href="https://witology.com.tw/en/post/4619/">August_Semiconductor｜Advanced Packaging Technology for High Performance Computing Chips(M)</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://witology.com.tw/en/post/4619/embed/#?secret=3MBRdyJVUZ" width="600" height="338" title=""August_Semiconductor｜Advanced Packaging Technology for High-Performance Computing Chips(Middle)" - SmartPol Research Institute for Industrial Trends" data-secret="3MBRdyJVUZ" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript">
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</script>https://witology.com.tw/wp-content/uploads/2023/08/c-1-e1692003590655.jpg1170541根據IEEE發布的異質整合技術發展藍圖報告指出，短期"高性能計算晶片"係以大面積中介層、嵌入式橋接載板、小孔徑比矽通孔、面對面晶片堆疊、混和鍵合等技術鏈結其他晶片，說明如下:大面積中介層:是目前高性能計算晶片採用之5D封裝主流技術，通常透過中介層連結四顆高頻寬記憶體(HBM)